Practical SMT Tools for the shop floor & engineering desk

Determine correct bake time for moisture-sensitive components per J-STD-033D. Enter MSL level, body thickness, and floor life exposure to get the required bake time at 125, 90, 60, or 40°C.

Calculate the solder paste volume and stencil aperture dimensions for through-hole reflow (THR) components. Supports round and rectangular pin cross-sections. Based on IPC-7525A methodology and Pappus-Guldin fillet geometry.

Calculate required drying time for bare printed circuit boards before assembly. Based on PCB material group, storage duration, and target moisture level, using the Arrhenius diffusion model from the Solectron Aquaboard study.

Select a solder defect, component package, and process phase to get ranked root causes with detailed explanations and specific corrective actions. Covers bridging, opens, tombstoning, voiding, HiP, cold joints, and more.

Evaluate your stencil aperture design against IPC guidelines. Get instant feedback on area ratio, aspect ratio, and paste release - before you order the stencil.

Calculate aperture volume, paste deposit volume after transfer efficiency, and estimated solder volume after reflow. Includes IPC-7525A area ratio verdict and lead-free aperture guidance. Supports rectangular and circular apertures.

Calculate the capacity and utilization of your SMT production line. Factor in line speed, OEE, shift model, and product mix to understand your true production potential.

Check whether your reflow oven can keep up with your SMT line, or calculate the minimum heated tunnel length needed for a target production rate. Includes P&P bottleneck check and oven class reference.

Calculate your SMT line's actual globally derated placement rate from real production data. Enter elapsed time and product mix to find the true CPH your line delivered across a shift or run.

Decode surface mount resistor markings on the spot. Supports 3-digit, 4-digit, and EIA-96 precision codes. Reverse lookup from resistance value to code. Built for operators and quality inspectors.

Compare RoHS-compliant lead-free solder alloys side by side. Filter by category or process type, sort by thermal properties, and select up to three alloys for a direct comparison. Covers SAC305, SN100C, BiSn, Innolot, and more.

Free Excel workbook for tracking moisture-sensitive component floor life across your production floor. Color-coded dashboard, bake event logging, ambient RH correction per J-STD-033D, and automatic floor life recalculation. Requires Microsoft 365 or Excel 2021.

Decode any J-STD-004B flux designator to its base material, activity level, and halide content. Reverse lookup from properties to designator. Covers all 24 codes from Table 3-9 with a built-in guide to flux chemistry and cleaning decisions. Based on J-STD-004B with Amendment 1.

Find the right IPC or J-STD document fast. Search by keyword, process area, or standard number across 75+ indexed standards covering assembly, PCB design, fabrication, materials, cleaning, conformal coating, testing, surface finishes, and more.

Calculate the realistic maximum capacity of a single SMT line. Models placer throughput, reflow oven bottleneck, OEE decomposition, panelisation, changeover losses, and multi-product utilisation. Free Excel workbook, no macros, works offline.

A slot machine with electronic components instead of fruits. IC chips pay the jackpot, SMD resistors pay the least. Five win lines and a doubling feature. For entertainment only -- no real money involved.